Application R&D
Rapid product selection, process matching and sample validation through our Shenzhen application center.
Functional Materials · Process Solutions
Functional materials for reliable semiconductor manufacturing.
Hongxin develops and manufactures process tapes and functional films for wafer processing, advanced packaging, displays and precision electronics.
Precision coatingApplication validationReliable volume supply
MATERIALS + APPLICATIONFrom product selection to process validation and volume supply.
How We Work
Materials engineered around your process.
We connect material development, precision coating and application engineering to help customers move from sample evaluation to stable mass production.
Precision Manufacturing
Controlled coating, lamination and converting for stable thickness, adhesion and release performance.
Responsive Supply
A Jiangsu smart manufacturing base supports pilot trials, scale-up and reliable delivery.
Process Map
Coverage from wafer preparation to package singulation.
One materials partner across critical bonding, protection and de-bonding steps.
01Wafer GrindingSurface protection
02Wafer DicingSecure and release
03Die AttachStable bonding
04Advanced PackagingHeat and molding protection
05Package SawClean singulation
Material Platforms
Six platforms. One focus: process stability.
Select by de-tack mechanism, thermal requirement, substrate and application. Final specifications are confirmed through application testing.
UC Series
UV De-Tack Tape
High tack before UV, low tack after irradiation. For grinding, dicing and LED processing.
UN Series
Non-UV Process Tape
Stable adhesion and clean mechanical release for grinding and dicing.
TR Series
Thermally Activated De-Tack Tape
Temperature-triggered release with low residue for MLCC and temporary fixing.
TF Series
High-Temperature Protection Tape
Heat resistance and anti-sputtering protection for molding and packaging.
NS Series
Specialty Release Film
Silicone-free, clean release performance for injection molding processes.
CB Series
Die Attach Film
Thermally stable, high-bond film for die attach and package bonding.
Featured Solutions
Solve the process challenge, not just the material specification.
Our product selection starts with substrate, surface condition, temperature, equipment and de-bonding requirements.
About Hongxin
A functional-material partner for advanced manufacturing.
Shenzhen Hongxin Semiconductor Materials Co., Ltd. focuses on the development, manufacturing and application service of functional films for semiconductor packaging and advanced processes. We provide integrated support covering material development, product design, precision coating, application validation and scaled manufacturing.
Discover HongxinShenzhenApplication R&D Center
JiangsuSmart Manufacturing Base
6Functional Material Platforms
IntegratedDevelopment to Volume Supply